#### Authored books

V. F. Pavlidis and E. G. Friedman, *Three-Dimensional Integrated Circuit Design*, Morgan Kaufmann Publishers, ISBN: 978-0-12-374343-5, 2009. Translated in Chinese by China Machine Press ISBN 978-7-111-43351-4.

V. F. Pavlidis, I. Savidis, and E. G. Friedman

*Three-Dimensional Integrated Circuit Design, 2nd Edition*, Morgan Kaufmann Publishers, ISBN:978-0-12-41501-0.

- V. F. Pavlidis and E. G. Friedman, “Physical and Interconnect Design Issues in 3-D Integration Technologies,” in
*VLSI-SOC: Design Methodologies for SoC and SiP*, pp. 1-21, Dimitrios Soudris, Christian Piguet, and Ricardo Reis (eds.), Springer, ISBN: 978-3-642-12266-8, 2010. - V. F. Pavlidis and E. G. Friedman, “Physical Analysis of 3-D Topologies for NoCs,” in
*3D-Integration for NoC-based SoC Architectures*, Abbas Sheibanyrad, Frederic Petrot, and Axel Jantsch (eds.), Springer, ISBN: 978-1-4419-7617-8, pp. 89-114, 2011. - A. Strano, D. Ludovici, D. Bertozzi, V. F. Pavlidis, F. Angiolini, and M. Krstic, “The Synchronization Challenge,” in
*Designing Network-on-Chip Architectures in the Nanoscale Era*, José Flich, and Davide Bertozzi (eds.), Chapman & Hall/CRC Press, ISBN: 978-1-4398-3710-8, pp. 175-234, 2011. - I. Papistas and V. F. Pavlidis, "Efficient Modeling of Crosstalk Noise on Power Distribution Networks for Contactless 3-D ICs,"
*IEEE Transactions on Circuits and Systems-I:Regular Papers,*Vol. 99, No. 99, 2018. - S. Ladenheim, Y.-C. Chen, M. Mihajlovic, and V. F. Pavlidis, "The MTA: An Advanced and Versatile Thermal Simulator for Integrated System,"
*IEEE Transactions on Computer-Aided Design on Integrated Circuits and Systems,*Vol. 99, No. 99, 2018. - H. Kalargaris and V. F. Pavlidis, "Voltage scaling for 3-D ICs: When, how, and how much?"
*Microelectronics Journal*, Vol. 69, pp. 35-44, September 2017. - H. Xu, V. F. Pavlidis, X. Tang, W. Burleson, and G. De Micheli, "Timing Uncertainty in 3-D Clock Trees Due to Process Variations and Power Supply Noise,"
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems,*Vol. 21, No. 12, pp. 2226-2239, December 2013. - S. Rahimian, V. F. Pavlidis, and G. De Micheli, "An Enhanced Design Methodology for Resonant Clock Trees,"
*Journal of Low Power Electronics,*Vol. 9, No. 2, pp. 198-206, August 2013. - H. Xu, V. F. Pavlidis, and G. De Micheli, "Effects of Process Variations on 3-D Global Clock Distribution Networks,"
*ACM Journal on Emerging Technologies in Computing Systems,*Vol. 8, No. 3, Article 20, August 2012. - S. Rahimian, V. F. Pavlidis, and G. De Micheli, "Inter-Plane Communication Methods for 3-D ICs,"
*Journal of Low Power Electronics,*Vol. 8, No. 2, pp. 170-181, April 2012. - K. Siozios, V. F. Pavlidis, and D. Soudris, "A Novel Framework for Exploring 3-D FPGAs with Heterogeneous Interconnect Fabric,"
*ACM Transactions on Reconfigurable Technology and Systems,*Vol. 5, No. 1, pp. 4:1-4:23, March 2012. - V. F. Pavlidis, I. Savidis, and E. G. Friedman, "Clock Distribution Networks for 3-D Integrated Circuits,"
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems,*Vol. 19, No. 12, pp. 2256-2266, December 2011. - V. F. Pavlidis and E. G. Friedman, "Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits,"
*Proceedings of the IEEE, Special Issue on 3-D Integration Technologies*, Vol. 97, No, 1, pp. 123-140, January 2009. - V. F. Pavlidis and E. G. Friedman, "3-D Topologies for Networks-on-Chip,"
*IEEE Transactions on Very Large Scale Integration (VLSI) Systems*, Vol. 15, No. 10, pp. 1081-1090, October 2007**(included in the Top 25 Downloadable Manuscripts for 2009)**. - V. F. Pavlidis and E. G. Friedman, "Timing Driven Via Placement Heuristics in 3-D ICs ,"
*Integration the VLSI Journal*, Vol. 41, No. 4, pp. 489-508, July 2008. - Y.-C. Chen, S. Ladenheim, H. Kalargaris, M. Mihajlovic, and V. F. Pavlidis,"Computationally Efficient Standard-Cell FEM-based Thermal Analysis,"
*Proceedings of the ACM/IEEE International Conference on Computer-Aided Design*, pp. 490-495, November 2016. - I. Papistas and V. F. Pavlidis, "Contactless Inter-Tier Communication for Heterogeneous 3-D ICs,"
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 2585-2588, May 2017. - I. Papistas and V. F. Pavlidis, "Comparative Study of Crosstalk Noise Due to Inductive Links on Heterogeneous 3-D ICs,"
*Proceedings of the IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave, and Terahertz Applications,*pp. 314-316, May 2017. - K. Maragos, G. Lentaris, K. Siozios, D. Soudris, and V. F. Pavlidis, "Application Performance Improvement By Exploiting Process Variability On FPGA Devices,"
*Proceedings of the Design, Automation, and Test Conference in Europe,*pp. 452-457, March 2017. - H. Kalargaris, Yi-Chung Chen, and V. F. Pavlidis, "STA Compatible Backend Design Flow for TSV-based 3-D ICs,"
*Proceedings of the IEEE International Symposium on Quality Electronic Design*, pp. 186-191, March 2017. - S. Ladenheim, Y.-C. Chen, M. Mihajlovic, and V. F. Pavlidis, "IC Thermal Analyzer for Versatile 3-D Structures Using Multigrid Preconditioned Krylov Methods,"
*Proceedings of the ACM/IEEE International Conference on Computer-Aided Design*, November 2016. - H. Kalargaris, J. Goodacre, and V. F. Pavlidis, "Advanced Circuit Interface for Systems with Multiple Voltage Domains,"
*Proceedings of the IEEE International Ph.D. Research in Microelectronics and Electronics Conference*, pp. 1-4, June 2016. - I. Papistas and V. F. Pavlidis, "Crosstalk Noise Effects of On-Chip Inductive Links on Power Delivery Networks,"
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 1938-1941, May 2016. - I. Papistas and V. F. Pavlidis, "Inter-Tier Crosstalk Noise on Power Delivery Networks for 3-D ICs with Inductively-Coupled Interconnects,"
*Proceedings of the ACM/IEEE Great Lakes Symposium on VLSI*, pp. 257-262, May 2016. - I. Papistas and V. F. Pavlidis, "Bandwidth-to-Area Comparison of Through Silicon Vias and Inductive Links for 3-D ICs,"
*Proceedings of the IEEE European Conference on Circuit Theory and Design*, August 2015. - H. Kalargaris and V. F. Pavlidis, "Interconnect Design Tradeoffs for Silicon and Glass Interposers,"
*Proceedings of the IEEE International Conference on New Circuits and Systems*, pp. 77-80, June 2014. - P. W. Nutter, V. F. Pavlidis, and J. Pepper, "Efficient Teaching of Digital Design with Automated Assessment and Feedback,"
*Proceedings of the European Workshop on Microelectronics Education*, pp. 203-207, May 2014. - S. Bobba, P.-E. Gaillardon, C. Seiculescu, V. F. Pavlidis, and G. De Micheli, "3.5-D Integration: A Case Study,"
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 2087-2090, May 2013. - S. Rahimian, V. F. Pavlidis, and G. De Micheli, "Low-Power Clock Distribution Networks for 3-D ICs,"
*Proceedings of the Convention of Electrical and Electronics Engineers in Israel,*November 2012. - V. F. Pavlidis, H. Xu, and G. De Micheli, "Enhanced Wafer Matching Heuristics for 3-D ICs,"
*Proceedings of the IEEE European Test Symposium*, pp. 178, May 2012. - H. Xu, V. F. Pavlidis, W. Burleson, and G. De Micheli, "The Combined Effect of Process Variations and Power Supply Noise on Clock Skew and Jitter,"
*Proceedings of the IEEE International Symposium on Quality Electronic Design,*pp. 322-329, March 2012. - C. Zhang, V. F. Pavlidis, and G. De Micheli, “Voltage Propagation Method for 3-D Power Grid Analysis,”
*Proceedings of the Conference on Design, Automation, and Test, in Europe,*pp. 844-847, March 2012. - S. Rahimian, V. F. Pavlidis, and G. De Micheli, "Design of Resonant Clock Dostribution Networks for 3-D Integrated Circuits,"
*Proceedings of the Power, Timing Modeling, Optimization, and Simulation Workshop,*pp. 267-277, September 2011. - G. De Micheli, V. F. Pavlidis, D. Atienza, and Y. Leblebici, "Design Methods and Tools for 3D Integration,"
*Proceedings of the VLSI Technology Symposium,*pp. 182-183, June 2011. - H. Xu, V. F. Pavlidis, and G. De Micheli, "Skew Variability in 3-D ICs with Multiple Clock Domains,"
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 2221-2224, May 2011. - I. Savidis, V. F. Pavlidis, and E. G. Friedman, "Clock Distribution Models of 3-D Integrated Systems,"
*Proceedings of the IEEE International Symposium on Circuits and Systems,*pp. 2225-2228, May 2011. - H. Xu, V. F. Pavlidis, and G. De Micheli, “Analytical Heat Transfer Model for Thermal Through-Silicon Vias,”
*Proceedings of the Conference on Design, Automation, and Test, in Europe,*pp. 395-400, March 2011. - I. Tsioutsios, V. Pavlidis, and G. De Micheli, “Physical Design Tradeoffs in Power Distribution Networks for 3-D ICs,”
*Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems*, pp. 435-438, December 2010. - V. Pavlidis, H. Xu, I. Tsioutsios, and G. De Micheli, “Synchronization and Power Integrity Issues in 3-D ICs,”
*Proceedings of Asia Pacific Conference on Circuits and Systems*, pp. 536-539, December 2010. - S. K. Bobba, A. Chakraborthy, O. Thomas, P. Batude, V. Pavlidis, and G. De Micheli, “Performance Analysis of 3-D Monolithic Integrated Circuits,”
*Proceedings of the IEEE International 3D System Integration Conference*, November 2010. - H. Xu, V. F. Pavlidis, and G. De Micheli, “Process-Induced Skew Variation for Scaled 2-D and 3-D ICs,”
*Proceedings of the System Level Interconnect Prediction Workshop*, pp. 17-24, June 2010. - H. Xu, V. F. Pavlidis and G. De Micheli, “Repeater insertion for Two-Terminal Nets in Three-Dimensional Integrated Circuits,”
*Proceedings of the International ICST Conference on Nano-Networks*, pp. 141-150, October 2009. - V. F. Pavlidis and G. De Micheli, “Power Distribution Paths for 3-D ICs,”
*Proceedings of the International ACM Great Lakes Symposium on Very Large Scale Integration*, pp. 263-268, May 2009. - K. Siozios, V. F. Pavlidis, and D. Soudris, “A Software-Supported Methodology for Exploring Interconnection Architectures Targeting 3-D FPGAs,”
*Proceedings of the Design, Automation, and Test Conference in Europe*, pp. 172-177, April 2009. - V. F. Pavlidis, I. Savidis, and E. G. Friedman, “Clock Distribution Architectures for 3-D SOI Integrated Circuits,”
*Proceedings of the IEEE International Silicon-on-Insulator Conference*, pp. 111-112, October 2008. - V. F. Pavlidis, I. Savidis, and E. G. Friedman, “Clock Distribution Networks for 3-D Integrated Circuits,”
*Proceedings of the IEEE International Conference on Custom Integrated Circuits*, pp. 651-654, September 2008**(An AMD/CICC Student Scholarship Award was awarded to this paper)**. - K. Siozios, K. Sotiriadis, V. F. Pavlidis, and D. Soudris, “A Software-Supported Methodology for Designing High-Performance 3D FPGA Architectures,”
*Proceedings of the International Conference on VLSI-SoC*, pp. 54-59, October 2007. - K. Siozios, K. Sotiriadis, V. F. Pavlidis, and D. Soudris, “Exploring Alternative 3D FPGA Architectures: Design Methodology and CAD Tool Support,”
*Proceedings of the IEEE International Conference on Field Programmable Logic and Applications*, pp. 652-655, August 2007. - V. F. Pavlidis and E. G. Friedman, “Three–Dimensional (3-D) Topologies for Networks-on-Chip,”
*Proceedings of the IEEE International System on Chip Conference*, pp. 285-288, September 2006. - V. F. Pavlidis and E. G. Friedman, “Via Placement for Minimum Interconnect Delay in Three-Dimensional (3-D) Circuits,”
*Proceedings of the IEEE International Symposium on Circuits and Systems*, pp. 4587-4590, May 2006. - V. F. Pavlidis and E. G. Friedman, “Interconnect Delay Minimization through Interlayer Via Placement in 3-D ICs,”
*Proceedings of the ACM Great Lakes Symposium on Very Large Scale Integration*, pp. 20-25, April 2005. - D. Soudris, K. Sgouropoulos, K. Tatas, V. F. Pavlidis, and A. Thanailakis, “A Methodology for Implementing FIR Filters and CAD Tool Development for Designing RNS-Based Systems,”
*Proceedings of the International Symposium on Circuits and Systems*, pp. 129-132, May 2003. - D. Soudris, V. F. Pavlidis, and A. Thanailakis, “Designing Low-Power Energy Recovery Adders Based On Pass Transistor Logic,”
*Proceedings of the IEEE International Conference on Electronics, Circuits, and Systems*, pp. 777-780, September 2001.

#### Book chapters

#### Journals

#### Conferences

#### Other articles (non-peer reviewed)

La 3D révolutionne le monde des microprocesseurs,*Science & Vie*, No. 1094, p. 54, November 2008.

University of Rochester (2008, September 17). 3-D Computer Processor: 'Rochester Cube' Points Way To More Powerful Chip Designs.

*Science Daily*.